Download Advanced millimeter-wave technologies : antennas, packaging by Duixian Liu; et al PDF

By Duixian Liu; et al

ISBN-10: 047099617X

ISBN-13: 9780470996171

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The individual layers are printed with thick-film paste to create the metalization patterns, aligned with the other layers, and are laminated at elevated temperature and pressure. Resistors and capacitors, compatible with the green tape process, may also be fabricated. The feature size depends on the thick film process, which has a typical conductor line width of 200 µm down to 100 µm. low-temperature cofired ceramic (LTCC) MCMs are a good choice for low-loss and good thermal conductivity [25, 26].

The packaging of MMICs is primarily an outgrowth of the microwave hybrid integrated circuit (MIC) technology and the discrete device packaging technology [22, 23]. Fabricating MMICs can be high cost and high risk. Volumes are usually small to medium size with reasonably fast fabrication and turnaround times. The design is key to ensure correct fabrication, minimum costs, and first pass design. 10 shows an illustration of on-chip microstrip interconnects in MMIC and silicon IC process technologies.

A candidate fully integrated mmWave silicon-based transceiver is presented with each block detailed and its performance summarized. Then a discussion of alternative methods ensues based upon direct antenna modulation for higher efficiency and security. It is presented in the context of a 60 GHz system with experimental results. 35 and 18 GHz along with experimental results. Chapter 15 extends the application space of mmWave to imaging, which among many other applications, expands our vision by letting us ‘see’ things under poor visibility conditions.

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