By Duixian Liu; et al
Read Online or Download Advanced millimeter-wave technologies : antennas, packaging and circuits PDF
Best electronics books
This publication provides the advance and experimental validation of the structural try out technique referred to as Oscillation-Based try out – OBT briefly. the consequences awarded the following assert, not just from a theoretical perspective, but in addition in response to a large experimental help, that OBT is a good defect-oriented try out answer, complementing the prevailing practical try out strategies for mixed-signal circuits.
"In their attention-grabbing research of the hot background of knowledge know-how, H. Peter Alesso and Craig F. Smith show the styles in discovery and innovation that experience introduced us to the current tipping element. . . . A iteration from now, each person can have in my opinion adapted entry to the full of information .
One of many most powerful traits within the layout and manufacture of recent electronics programs and assemblies is the usage of floor mount expertise as a substitute for through-hole tech nology. The mounting of digital units and parts onto the outside of a broadcast wiring board or different substrate bargains many merits over putting the leads of units or parts into holes.
- Analogue Electronics for Higher Studies
- Smart Material Systems and MEMS: Design and Development Methodologies
- QFT in strongly correlated electronic systems
- The Electronic States of the Helium Molecule
- Biopolymer Composites in Electronics
- An Introduction to High Reliability Soldering and Circuit Board Repair
Additional resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
The individual layers are printed with thick-film paste to create the metalization patterns, aligned with the other layers, and are laminated at elevated temperature and pressure. Resistors and capacitors, compatible with the green tape process, may also be fabricated. The feature size depends on the thick film process, which has a typical conductor line width of 200 µm down to 100 µm. low-temperature cofired ceramic (LTCC) MCMs are a good choice for low-loss and good thermal conductivity [25, 26].
The packaging of MMICs is primarily an outgrowth of the microwave hybrid integrated circuit (MIC) technology and the discrete device packaging technology [22, 23]. Fabricating MMICs can be high cost and high risk. Volumes are usually small to medium size with reasonably fast fabrication and turnaround times. The design is key to ensure correct fabrication, minimum costs, and first pass design. 10 shows an illustration of on-chip microstrip interconnects in MMIC and silicon IC process technologies.
A candidate fully integrated mmWave silicon-based transceiver is presented with each block detailed and its performance summarized. Then a discussion of alternative methods ensues based upon direct antenna modulation for higher efficiency and security. It is presented in the context of a 60 GHz system with experimental results. 35 and 18 GHz along with experimental results. Chapter 15 extends the application space of mmWave to imaging, which among many other applications, expands our vision by letting us ‘see’ things under poor visibility conditions.